17 Reviews
4.7
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A
ag*****ny
16 Nov 2024
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Characteristics
Material
OthersDescription
Details:
High bonding strength, neutral PH, strong insulation, smooth welding surface
Corrosion-free IC and PCB
Its boiling point is only slightly higher than the melting point of solder
For mobile phones, PC cards and other complex electronic chips, it is helpful for welding
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Product ID: 480002 In stock: 610 16 Views
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